发明申请
- 专利标题： Ultra-thin near-hermetic package based on rainier
- 专利标题（中）： 超薄的近密封包装，基于更加细腻
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申请号： US11803006申请日： 2007-05-11
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公开(公告)号： US20080277775A1公开(公告)日： 2008-11-13
- 发明人: Kenneth Allen Honer , Philip Damberg
- 申请人： Kenneth Allen Honer , Philip Damberg
- 申请人地址： US CA San Jose
- 专利权人： Tessera, Inc.
- 当前专利权人： Tessera, Inc.
- 当前专利权人地址： US CA San Jose
- 主分类号： H01L23/02
- IPC分类号： H01L23/02 ; H01L21/52 ; H05K7/00 ; H05K3/00
摘要：
A microelectronic package including a dielectric layer having top and bottom surfaces, the dielectric layer having terminals exposed at the bottom surface; a metallic wall bonded to the dielectric layer and projecting upwardly from the top surface of the dielectric layer and surrounding a region of the top surface; a metallic lid bonded to the wall and extending over the region of the top surface so that the lid, the wall and the dielectric layer cooperatively define an enclosed space; and a microelectronic element disposed within the space and electrically connected to the terminals.
公开/授权文献
- US08508036B2 Ultra-thin near-hermetic package based on rainier 公开/授权日：2013-08-13
信息查询
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