Invention Application
- Patent Title: Semiconductor Device and Method for Manufacturing the Same
- Patent Title (中): 半导体装置及其制造方法
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Application No.: US12117442Application Date: 2008-05-08
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Publication No.: US20080277792A1Publication Date: 2008-11-13
- Inventor: SANG HEE LEE , Gab Hwan Cho
- Applicant: SANG HEE LEE , Gab Hwan Cho
- Priority: KR10-2007-0045626 20070510
- Main IPC: H01L23/528
- IPC: H01L23/528 ; H01L21/768
Abstract:
Overlapping dummy patterns for a semiconductor device are disclosed. According to an embodiment, a first dummy pattern is formed on a substrate; a second dummy pattern is formed to be overlapped with the first dummy pattern; and a third dummy pattern is formed to provide an electrical connection between the first dummy pattern and the second dummy pattern.
Information query
IPC分类:
