发明申请
- 专利标题： Semiconductor package and method of forming the same
- 专利标题（中）： 半导体封装及其形成方法
-
申请号： US12149741申请日： 2008-05-07
-
公开(公告)号： US20080277800A1公开(公告)日： 2008-11-13
- 发明人: Tae-Joo Hwang , Tae-Gyeong Chung , Eun-Chul Ahn
- 申请人： Tae-Joo Hwang , Tae-Gyeong Chung , Eun-Chul Ahn
- 专利权人： Samsung Electronics Co., Ltd.
- 当前专利权人： Samsung Electronics Co., Ltd.
- 优先权： KR10-2007-0044643 20070508
- 主分类号： H01L23/538
- IPC分类号： H01L23/538 ; H01L21/60
摘要：
Example embodiments relate to semiconductor packages and methods of forming the same. A semiconductor package according to example embodiments may include a printed circuit board (PCB), a first semiconductor chip mounted on the PCB, and a chip package mounted on the first semiconductor chip. The chip package may be in direct contact with the first semiconductor chip.
公开/授权文献
- US08022555B2 Semiconductor package and method of forming the same 公开/授权日：2011-09-20
信息查询
IPC分类:
