发明申请
- 专利标题: SEMICONDUCTOR PACKAGE USING CHIP-EMBEDDED INTERPOSER SUBSTRATE
- 专利标题(中): 半导体封装使用嵌入式嵌入式基板
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申请号: US12121490申请日: 2008-05-15
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公开(公告)号: US20080283996A1公开(公告)日: 2008-11-20
- 发明人: Min-Ho O , Jong-Ho LEE , Eun-Chul AHN , Pyoung-Wan KIM
- 申请人: Min-Ho O , Jong-Ho LEE , Eun-Chul AHN , Pyoung-Wan KIM
- 申请人地址: KR Gyeonggi-do
- 专利权人: SAMSUNG ELECTRONICS CO., LTD.
- 当前专利权人: SAMSUNG ELECTRONICS CO., LTD.
- 当前专利权人地址: KR Gyeonggi-do
- 优先权: KR2007-0047293 20070515
- 主分类号: H01L23/49
- IPC分类号: H01L23/49 ; H01L23/538
摘要:
A semiconductor package using a chip-embedded interposer substrate is provided. The chip-embedded interposer substrate includes a chip including a plurality of chip pads; a substrate having the chip mounted thereon and including a plurality of redistribution pads for redistributing the chip pads; bonding wires for connecting the chip pads to the redistribution pads; a protective layer having via holes for exposing the redistribution pads while burying the chip and the substrate; and vias connected to the redistribution pads through the via holes. The semiconductor package including chips of various sizes is fabricated using the chip-embedded interposer substrate.