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发明申请
US20080290491A1 Semiconductor package and stacked layer type semiconductor package 有权
半导体封装和堆叠层型半导体封装

Semiconductor package and stacked layer type semiconductor package
摘要：
In a stacked layer type semiconductor package constructed by stacking a plurality of packages with each other, the plurality of packages include a semiconductor package including: a semiconductor chip; a substrate in which a concave portion has been formed, the semiconductor chip being mounted in the concave portion; and a wiring line structure constructed in such a manner that the wiring line structure can be externally connected to the semiconductor chip at least just above and just under the semiconductor chip.
摘要（中）：

在通过将多个封装彼此堆叠而构成的堆叠层型半导体封装中，所述多个封装包括半导体封装，包括：半导体芯片; 形成有凹部的基板，将半导体芯片安装在凹部内; 以及以这样的方式构成的布线线路结构，使得布线线结构可以至少刚好在半导体芯片的正上方和外部连接到半导体芯片。

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