发明申请
- 专利标题: METHOD AND APPARATUS FOR COOLING ELECTRONIC EQUIPMENT
- 专利标题(中): 冷却电子设备的方法和装置
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申请号: US12101839申请日: 2008-04-11
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公开(公告)号: US20080291626A1公开(公告)日: 2008-11-27
- 发明人: Dean H. Nelson , Andreas V. Bechtolsheim , Michael C. Ryan
- 申请人: Dean H. Nelson , Andreas V. Bechtolsheim , Michael C. Ryan
- 申请人地址: US CA Santa Clara
- 专利权人: Sun Microsystems, Inc.
- 当前专利权人: Sun Microsystems, Inc.
- 当前专利权人地址: US CA Santa Clara
- 主分类号: H05K7/20
- IPC分类号: H05K7/20
摘要:
A method for cooling electronic equipment. The method including propagating air through a first electronic component of the electronic equipment into a first enclosed area, where propagating the air through the first electronic component cools the first electronic component, circulating a refrigerant in a cooling loop, where the cooling loop comprises a heat exchanger, and propagating the air out of the first enclosed area by passing through the heat exchanger into a second enclosed area, where the air is cooled by passing through the heat exchanger.
公开/授权文献
- US09301432B2 Method and apparatus for cooling electronic equipment 公开/授权日:2016-03-29
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