发明申请
US20080293204A1 Shallow junction formation and high dopant activation rate of MOS devices
有权
浅结点形成和MOS器件的高掺杂剂激活率
- 专利标题: Shallow junction formation and high dopant activation rate of MOS devices
- 专利标题(中): 浅结点形成和MOS器件的高掺杂剂激活率
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申请号: US11804927申请日: 2007-05-21
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公开(公告)号: US20080293204A1公开(公告)日: 2008-11-27
- 发明人: Chun-Feng Nieh , Keh-Chiang Ku , Nai-Han Cheng , Chi-Chun Chen , Li-Te S. Lin
- 申请人: Chun-Feng Nieh , Keh-Chiang Ku , Nai-Han Cheng , Chi-Chun Chen , Li-Te S. Lin
- 主分类号: H01L21/336
- IPC分类号: H01L21/336
摘要:
A method for forming a semiconductor structure includes providing a semiconductor substrate; forming a gate stack over the semiconductor substrate; implanting carbon into the semiconductor substrate; and implanting an n-type impurity into the semiconductor substrate to form a lightly doped source/drain (LDD) region, wherein the n-type impurity comprises more than one phosphorous atom. The n-type impurity may include phosphorous dimer or phosphorous tetramer.
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