Curing agent for epoxy resins, consisting of A) 1%-99% by weight of an adduct obtainable by reacting a1) a poly-ethylene polyamine having up to six nitrogens in the molecule with a2) a monoglycidyl ether, the adduct of a1) and a2) preferably being isolated by removal of the excess polyethylene polyamine, and B) 99%-1% by weight of an adduct obtainable by reacting b1) a diamine or polyamine with b2) acrylonitrile and/or C) 99%-1% by weight of a polyaminoamide, and also curable compositions further comprising an epoxide compound, and the use of these curable compositions for producing mouldings and sheetlike structures, and also for applications in the adhesives and sealants sector and for epoxy-resin mortars.