A production method of a multilayer electronic device, comprising the steps of forming a lower side green sheet 10a including at least a ceramic powder on a supporting body 20; forming an electrode pattern layer 12a on a surface of the lower side green sheet; forming a green chip by stacking multilayer units U1 including at least the lower side green sheet and an electrode pattern layer; and firing the green chip; wherein the lower side green sheet 10a formed on the supporting body 20 includes a binder of a curable resin, and the curable resin in the lower side green sheet 10a is cured before forming said electrode pattern layer 12a on the lower side green sheet.