发明申请
- 专利标题: LED-Based Light Source Having Improved Thermal Dissipation
- 专利标题(中): 基于LED的光源具有改善的散热
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申请号: US11755912申请日: 2007-05-31
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公开(公告)号: US20080296590A1公开(公告)日: 2008-12-04
- 发明人: Kee Yean Ng
- 申请人: Kee Yean Ng
- 主分类号: H01L33/00
- IPC分类号: H01L33/00 ; H01L21/00
摘要:
A light source having a plurality of dies mounted on leads that are partially enclosed in a plastic body is disclosed. Each die is powered by first and second contacts. One contact is connected to the lead on which the die is mounted. Light from the LED exits the die through the top surface. Each lead includes a layer of metal of substantially constant thickness. The layer includes a boundary, a die mounting region within the boundary and a heat transfer region within the boundary. The boundary increases in a dimension perpendicular to a line connecting the die mounting region and the heat transfer region. The leads are arranged such that the die mounting regions are proximate to a first point and oriented such that the lines radiate from the first point. The light source can be manufactured using conventional lead frame techniques.
公开/授权文献
- US07923831B2 LED-based light source having improved thermal dissipation 公开/授权日:2011-04-12
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