Invention Application
- Patent Title: Method of fabricating paste bump for printed circuit board
- Patent Title (中): 制造印刷电路板用焊膏凸块的方法
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Application No.: US12005353Application Date: 2007-12-27
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Publication No.: US20080307641A1Publication Date: 2008-12-18
- Inventor: Jee Soo Mok , Jun Heyoung Park , Ki Hwan Kim , Sung Yong Kim , Sang Hyun Park
- Applicant: Jee Soo Mok , Jun Heyoung Park , Ki Hwan Kim , Sung Yong Kim , Sang Hyun Park
- Applicant Address: KR Suwon
- Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee Address: KR Suwon
- Priority: KR10-2007-0057370 20070612
- Main IPC: H05K3/00
- IPC: H05K3/00
Abstract:
This invention relates to a method of fabricating a paste bump for a printed circuit board, which can decrease the number of printings to thus reduce the fabrication cost and process time in the formation of the paste bump on the printed circuit board.
Public/Granted literature
- US07841074B2 Method of fabricating paste bump for printed circuit board Public/Granted day:2010-11-30
Information query
