In one embodiment of the disclosure, a heat pipe device for dissipating heat from a heat source includes a porous wick structure having a first porous wick portion disposed adjacent to a second porous wick portion. The first porous wick portion is defined by a first set of microgrooves. The second porous wick portion is defined by a second set of microgrooves disposed in non-parallel adjacent alignment to the first set of microgrooves. The heat pipe device may be disposed within a closed chamber enclosure to which the heat source is attached. In further embodiments, methods are disclosed for manufacturing devices for dissipating heat from a heat source, and for using devices to dissipate heat from a heat source.