发明申请
US20080308933A1 INTEGRATED CIRCUIT PACKAGE SYSTEM WITH DIFFERENT CONNECTION STRUCTURES
审中-公开
具有不同连接结构的集成电路封装系统
- 专利标题： INTEGRATED CIRCUIT PACKAGE SYSTEM WITH DIFFERENT CONNECTION STRUCTURES
- 专利标题（中）： 具有不同连接结构的集成电路封装系统
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申请号： US11763154申请日： 2007-06-14
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公开(公告)号： US20080308933A1公开(公告)日： 2008-12-18
- 发明人: Lionel Chien Hui Tay , Zigmund Ramirez Camacho , Abelardo Hadap Advincula
- 申请人： Lionel Chien Hui Tay , Zigmund Ramirez Camacho , Abelardo Hadap Advincula
- 主分类号： H01L23/48
- IPC分类号： H01L23/48 ; H01L21/60
摘要：
An integrated circuit package system is provided including forming an external interconnect having a tip without a die-attach paddle; mounting a first integrated circuit device structure having a conductive ball over the tip; connecting a first wire between the first integrated circuit device structure and under the tip; and encapsulating the first integrated circuit device structure, the first wire, and the external interconnect with the external interconnect partially exposed.
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