发明申请
- 专利标题： Resin Sealing Apparatus and Resin Sealing Method
- 专利标题（中）： 树脂密封装置和树脂密封方法
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申请号： US12091159申请日： 2006-11-17
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公开(公告)号： US20080309015A1公开(公告)日： 2008-12-18
- 发明人: Kenji Ogata , Yoshihiro Mitsui
- 申请人： Kenji Ogata , Yoshihiro Mitsui
- 申请人地址： JP Kyoto
- 专利权人： Dai-Chi Seiko Co., Ltd
- 当前专利权人： Dai-Chi Seiko Co., Ltd
- 当前专利权人地址： JP Kyoto
- 优先权： JP2005341180 20051125; JP2006247028 20060912
- 国际申请： PCT/JP2006/323002 WO 20061117
- 主分类号： E04B1/682
- IPC分类号： E04B1/682
摘要：
A resin molten in a pot portion 59 is molded by being loaded via a gate 48 into a cavity, which has a rectangular parallelepiped shape in plan view and is formed of both molds 1 and 2, which are a second mold 2 and a first mold 1 that can make or release contact with the second mold 2. The pot portion 59 is provided at either one of the molds 1 and 2 and constituted of recess portions 54c located at prescribed intervals at the cavity. The recess portions 54c have a bottom surface constituted of part of a moving member 60 movable toward an opening portion. The gate 48 is structured so that one side of the cavity and the long side of the pot portion 59 are connected with each other.
公开/授权文献
- US08029720B2 Resin sealing apparatus and resin sealing method 公开/授权日：2011-10-04
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