- 专利标题: SMART INFORMATION CARRIER AND PRODUCTION PROCESS THERFOR
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申请号: US12142618申请日: 2008-06-19
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公开(公告)号: US20080314988A1公开(公告)日: 2008-12-25
- 发明人: Ingrid Geuens , Peter Willaert , Walther Wouters
- 申请人: Ingrid Geuens , Peter Willaert , Walther Wouters
- 优先权: EP07110832.8 20070622
- 主分类号: G06K19/02
- IPC分类号: G06K19/02
摘要:
A smart information carrier comprising a security element having two sides each side being laminated with at least one transparent polymer foil having a melting point higher than 150° C. so that the security element is surrounded by an edge at least 1 mm wide in which the at least one transparent polymer foil on each side of the security element are laminated to one another, the security element comprising an IC-module and a natural fibre-containing or synthetic fibre-containing continuous support exclusive of an antenna, the IC-module comprising an electronic chip and an antenna integrated therein, wherein the support is security printed on at least the side of the support nearer to the IC-module and the IC-module is at least substantially encapsulated with a transparent polymer or polymer mixture with a melting point up to 150° C. which also coats at least the part of the side of the support nearer to the IC-module non-adjacent to the IC-module; and a method for producing a smart information carrier comprising the steps of: security printing at least one side of a natural fibre-containing or synthetic fibre-containing continuous support; if only one side of the support is security printed the non-security-printed side of the support is placed on the lower melting point side of a two polymer laminate with the high melting point side having a melting point higher than 150° C. and an IC-module comprising an electronic chip and an antenna integrated therein is placed on the other side of the support; placing a further sheet of a two polymer laminate with the high melting point side having a melting point higher than 150° C. on the IC-module with the lower melting point side nearer the IC-module with at least one sheet of a polymer foil with a melting point of up to 150° C. between the IC-module and the lower melting point-side of the further sheet of a two-polymer laminate; laminating the resulting sandwich in a laminator; and punching out a smart information carrier so that the support is surrounded by an edge at least 1 mm wide in which the transparent polymer foil are directly laminated to one another, wherein said natural fibre-containing or synthetic fibre-containing continuous support is exclusive of an antenna.
公开/授权文献
- US08002194B2 Smart information carrier and production process therfor 公开/授权日:2011-08-23
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