Invention Application
US20080315066A1 Poly 4-Methyl-1-Pentene Resin Composition, Film and Mold for Production of Sealed Electronic Element Product
审中-公开
聚4-甲基-1-戊烯树脂组合物，用于生产密封电子元件产品的膜和模具
- Patent Title: Poly 4-Methyl-1-Pentene Resin Composition, Film and Mold for Production of Sealed Electronic Element Product
- Patent Title (中): 聚4-甲基-1-戊烯树脂组合物，用于生产密封电子元件产品的膜和模具
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Application No.: US11658992Application Date: 2005-07-28
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Publication No.: US20080315066A1Publication Date: 2008-12-25
- Inventor: Tooru Tanaka , Toshiyuki Hirose
- Applicant: Tooru Tanaka , Toshiyuki Hirose
- Applicant Address: JP Minato-ku
- Assignee: Mitsui Chemicals, Inc.
- Current Assignee: Mitsui Chemicals, Inc.
- Current Assignee Address: JP Minato-ku
- Priority: JP2004-227209 20040803
- International Application: PCT/JP05/13827 WO 20050728
- Main IPC: B28B7/34
- IPC: B28B7/34 ; C08F10/14 ; C08L23/00
Abstract:
A poly 4-methyl-1-pentene resin composition which includes a polymer containing 80% by mass or more of 4-methyl-1-pentene in which the resin composition has a melting point of 170 to 240° C. and a semicrystallization time of 70 to 220 seconds. Also provided are a release film having good releasibility, a mold for production of a sealed electronic element product having excellent heat resistance and releasibility and an LED mold, which are obtained by molding the resin composition.
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