发明申请
US20090001532A1 Plastic-Encapsulated Semiconductor Device with an Exposed Radiator at the Top and Manufacture Thereof
审中-公开
塑料封装的半导体器件，其顶部具有暴露的散热器并制造
- 专利标题： Plastic-Encapsulated Semiconductor Device with an Exposed Radiator at the Top and Manufacture Thereof
- 专利标题（中）： 塑料封装的半导体器件，其顶部具有暴露的散热器并制造
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申请号： US12160111申请日： 2006-12-27
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公开(公告)号： US20090001532A1公开(公告)日： 2009-01-01
- 发明人: Arata Shiomi
- 申请人： Arata Shiomi
- 申请人地址： JP Saitama
- 专利权人： SANKEN ELECTRIC CO., LTD.
- 当前专利权人： SANKEN ELECTRIC CO., LTD.
- 当前专利权人地址： JP Saitama
- 优先权： JP2006-002857 20060110
- 国际申请： PCT/JP2006/326012 WO 20061227
- 主分类号： H01L23/495
- IPC分类号： H01L23/495 ; H01L21/56
摘要：
A plastic-encapsulated semiconductor device is provided which comprises a plastic-encapsulant 4 formed with notches 14 for exposing outside an upper electrode 12a on a semiconducting element 2 and an inner end 13 of a lead terminal 3a, and a radiator 5 formed with a main radiator body 15 mounted on an upper surface 4a of plastic-encapsulant 4, and connections 16 in notches 14 for electrically connecting upper electrode 12a of semiconducting element 2 with lead terminal 3a through main radiator body 15. Alteration in shape of main radiator body 15 allows appropriate change in thermal volume of radiator 5 by adopting radiator 5 of different shape or size. Also, connections 16 may provide a current path to lead terminal 3a in an existing lead frame without need of change in shape of outer leads 3.
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