发明申请
- 专利标题： Semiconductor device, a method of manufacturing the same and an electronic device
- 专利标题（中）： 半导体装置及其制造方法以及电子装置
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申请号： US12155479申请日： 2008-06-05
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公开(公告)号： US20090001559A1公开(公告)日： 2009-01-01
- 发明人: Yukihiro Satou , Takeshi Otani , Hiroyuki Takahashi , Toshiyuki Hata , Ichio Shimizu
- 申请人： Yukihiro Satou , Takeshi Otani , Hiroyuki Takahashi , Toshiyuki Hata , Ichio Shimizu
- 专利权人： Renesas Technology Corp.
- 当前专利权人： Renesas Technology Corp.
- 优先权： JP2003-054638 20030228
- 主分类号： H01L23/34
- IPC分类号： H01L23/34
摘要：
A novel semiconductor device high in both heat dissipating property and connection reliability in mounting is to be provided. The semiconductor device comprises a semiconductor chip, a resin sealing member for sealing the semiconductor chip, a first conductive member connected to a first electrode formed on a first main surface of the semiconductor chip, and a second conductive member connected to a second electrode formed on a second main surface opposite to the first main surface of the semiconductor chip, the first conductive member being exposed from a first main surface of the resin sealing member, and the second conductive member being exposed from a second main surface opposite to the first main surface of the resin sealing member and also from side faces of the resin sealing member.