发明申请
US20090007404A1 Production Method of Multilayer Electronic Device 失效
多层电子设备的生产方法

  • 专利标题: Production Method of Multilayer Electronic Device
  • 专利标题(中): 多层电子设备的生产方法
  • 申请号: US11630697
    申请日: 2005-06-24
  • 公开(公告)号: US20090007404A1
    公开(公告)日: 2009-01-08
  • 发明人: Shigeki Sato
  • 申请人: Shigeki Sato
  • 申请人地址: JP Tokyo
  • 专利权人: TDK Corporation
  • 当前专利权人: TDK Corporation
  • 当前专利权人地址: JP Tokyo
  • 优先权: JP2004-190254 20040628
  • 国际申请: PCT/JP05/11588 WO 20050624
  • 主分类号: H01G4/12
  • IPC分类号: H01G4/12
Production Method of Multilayer Electronic Device
摘要:
A production method of a multilayer electronic device, comprising the steps of forming an electrode layer 12a on a first support sheet 20; forming a green sheet 10a on a surface of the electrode layer 12a to obtain a green sheet 10a having an electrode layer 12a; stacking the green sheets 10a, each having the electrode layer 12a, to form a green chip; and firing the green chip: wherein before stacking the green sheet 10a having the electrode layer 12a, an adhesive layer 28 is formed on a surface on the opposite side of the electrode layer side of the green sheet 10a having the electrode layer 12a; and the green sheet 10a having the electrode layer 12a formed thereon is stacked via the adhesive layer 28.
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