发明申请
US20090008754A1 RESIN-SEALED SEMICONDUCTOR DEVICE, LEADFRAME WITH DIE PADS, AND MANUFACTURING METHOD FOR LEADFRAME WITH DIE PADS
有权
树脂密封半导体器件，带DIE垫的LEADFRAME，以及具有DIE垫的LEADFRAME的制造方法
- 专利标题： RESIN-SEALED SEMICONDUCTOR DEVICE, LEADFRAME WITH DIE PADS, AND MANUFACTURING METHOD FOR LEADFRAME WITH DIE PADS
- 专利标题（中）： 树脂密封半导体器件，带DIE垫的LEADFRAME，以及具有DIE垫的LEADFRAME的制造方法
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申请号： US12208804申请日： 2008-09-11
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公开(公告)号： US20090008754A1公开(公告)日： 2009-01-08
- 发明人: Tomoki KAWASAKI , Yuichiro Yamada , Toshiyuki Fukuda , Shuichi Ogata
- 申请人： Tomoki KAWASAKI , Yuichiro Yamada , Toshiyuki Fukuda , Shuichi Ogata
- 申请人地址： JP Osaka
- 专利权人： MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
- 当前专利权人： MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
- 当前专利权人地址： JP Osaka
- 优先权： JP2004-326513 20041110
- 主分类号： H01L23/495
- IPC分类号： H01L23/495 ; H05K7/20 ; H01L21/58
摘要：
A resin-sealed semiconductor device with built-in heat sink prevents internal bulging and cracking caused by exfoliation of a semiconductor element from the heat sink when the vapor pressure of moisture absorbed into a gap between the semiconductor element and the heat sink rises during mounting of the semiconductor device to a printed circuit board using lead-free solder. By providing a plurality of separated die pads (502) in a mounting area for a semiconductor element (301) and adhering the semiconductor element (301) to the heat sink (105) via the die pads (502), space is opened up between the semiconductor element (301) and the heat sink (105) for sealing resin (304) to run into.
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