发明申请
- 专利标题： Stackable microelectronic device carriers, stacked device carriers and methods of making the same
- 专利标题（中）： 可堆叠微电子器件载体，堆叠器件载体及其制造方法
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申请号： US11825121申请日： 2007-07-02
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公开(公告)号： US20090008795A1公开(公告)日： 2009-01-08
- 发明人: Kenneth Allen Honer , Jae M. Park
- 申请人： Kenneth Allen Honer , Jae M. Park
- 申请人地址： US CA San Jose
- 专利权人： Tessera, Inc.
- 当前专利权人： Tessera, Inc.
- 当前专利权人地址： US CA San Jose
- 主分类号： H01L23/48
- IPC分类号： H01L23/48 ; H01L21/00
摘要：
A method of manufacturing a microelectronic package. The method includes the steps of attaching at least one microelectronic element to a tape having upper terminals projecting upwardly from an upper surface of a dielectric layer, so that top surfaces of the terminals are disposed coplanar with or above a top surface of the microelectronic element after the attaching step, electrically connecting the microelectronic element to at least some of the upper terminals; and further includes the step of applying an encapsulant to cover at least a portion of the upper surface of the dielectric layer, leaving the upper terminals surfaces of the terminals exposed.
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