发明申请
- 专利标题: Curable resin composition, molded product, and process for producing the same
- 专利标题(中): 可固化树脂组合物,模塑产品及其制备方法
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申请号: US11659117申请日: 2005-08-04
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公开(公告)号: US20090008834A1公开(公告)日: 2009-01-08
- 发明人: Shintaro Yamauchi , Kazuo Otani
- 申请人: Shintaro Yamauchi , Kazuo Otani
- 申请人地址: JP Tokyo
- 专利权人: SHOWA HIGHPOLYMER CO., LTD.
- 当前专利权人: SHOWA HIGHPOLYMER CO., LTD.
- 当前专利权人地址: JP Tokyo
- 优先权: JP2004-230502 20040806
- 国际申请: PCT/JP2005/014339 WO 20050804
- 主分类号: C08G59/50
- IPC分类号: C08G59/50 ; C08L63/10 ; C08G59/66 ; B29C35/02 ; B29C35/08
摘要:
By heating, allowing to stand at normal temperature, or irradiating in the presence of a photo-polymerization initiator, a curable resin composition which contains (A) a resin material having a radical polymerizable unsaturated group and an epoxy group, (C) a radical polymerization initiator, (D) an amine compound and/or a mercaptan compound containing one or more of active hydrogen in one molecule, and (E) a compound, which is an adduct in which the (D) amine compound and/or a mercaptan compound, is reacted with the radical polymerizable unsaturated group of the (A) resin material, thereby a cured product can be obtained.
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