Invention Application
- Patent Title: METHOD FOR TREATING SURFACE OF HEAT DISSIPATING MODULE
- Patent Title (中): 热处理模块表面处理方法
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Application No.: US12146475Application Date: 2008-06-26
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Publication No.: US20090011131A1Publication Date: 2009-01-08
- Inventor: Yu-Cheng Chou , Te-Li Tsai , Ming-Feng Tsai , Chich-Hua Shen , Hsueh-Lung Cheng
- Applicant: Yu-Cheng Chou , Te-Li Tsai , Ming-Feng Tsai , Chich-Hua Shen , Hsueh-Lung Cheng
- Applicant Address: TW Taipei
- Assignee: AMA PRECISION INC.
- Current Assignee: AMA PRECISION INC.
- Current Assignee Address: TW Taipei
- Priority: TW96124681 20070706
- Main IPC: B05D3/10
- IPC: B05D3/10 ; B05D1/18
Abstract:
A method for treating the surface of the heat dissipation module is provided. The method includes the following steps. First, a heat dissipation module is provided. Next, a nano-material layer is formed on the surface of the heat dissipation module. Thus, the surface of the heat dissipation module is isolated from air and effectively prevented from being oxidized or polluted.
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