发明申请
US20090014435A1 Heating apparatus, substrate processing apparatus employing the same, method of manufacturing semiconductor devices, and insulator
有权
加热装置，采用该加热装置的基板处理装置，制造半导体装置的方法和绝缘体
- 专利标题： Heating apparatus, substrate processing apparatus employing the same, method of manufacturing semiconductor devices, and insulator
- 专利标题（中）： 加热装置，采用该加热装置的基板处理装置，制造半导体装置的方法和绝缘体
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申请号： US12213824申请日： 2008-06-25
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公开(公告)号： US20090014435A1公开(公告)日： 2009-01-15
- 发明人: Akira Hayashida , Masaaki Ueno , Masakazu Shimada , Masashi Sugishita , Toshimitsu Miyata , Kimio Kitamura , Kenji Tanaka , Jyunichi Nishihara
- 申请人： Akira Hayashida , Masaaki Ueno , Masakazu Shimada , Masashi Sugishita , Toshimitsu Miyata , Kimio Kitamura , Kenji Tanaka , Jyunichi Nishihara
- 申请人地址： JP Tokyo JP Osaka
- 专利权人： Hitachi Kokusai Electric Inc.,Teitokusha Co., Ltd.
- 当前专利权人： Hitachi Kokusai Electric Inc.,Teitokusha Co., Ltd.
- 当前专利权人地址： JP Tokyo JP Osaka
- 优先权： JP2007-166997 20070625; JP2008-154357 20080612
- 主分类号： H05B3/06
- IPC分类号： H05B3/06 ; H01L21/00 ; H05B3/02
摘要：
A heating apparatus comprises a heating element, an inner shell for supporting the heating element, an outer shell disposed along the outer boundary of the inner shell, a cooling medium passage for conveying a cooling medium between the inner shell and the outer shell, a first opening provided in the inner shell, a second opening provided in the outer shell, and a partition arranged to extend from the first opening to the second opening for developing at least a space separated from the cooling medium passage and between the inner shell and the outer shell. The heating apparatus further comprises an insulator for shutting up a gap provided between the partition and the second opening.
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