发明申请
- 专利标题： ELECTRONIC DEVICE AND MANUFACTURING METHOD
- 专利标题（中）： 电子设备和制造方法
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申请号： US12106459申请日： 2008-04-21
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公开(公告)号： US20090014873A1公开(公告)日： 2009-01-15
- 发明人: Yasuo Yokota , Hisahiko Yoshida
- 申请人： Yasuo Yokota , Hisahiko Yoshida
- 优先权： JP2007-183969 20070713; JP2007-200484 20070801; JP2007-237717 20070913
- 主分类号： H01L23/48
- IPC分类号： H01L23/48 ; H01L21/58 ; H01L21/00
摘要：
An electronic device including a semiconductor device with a plurality of bump electrodes, a mounting board connected to the semiconductor device, thermally expandable particles, and adhesive. The thermally expandable particles are provided on the sides of the semiconductor device and the surface of the mounting board around a projected area of the semiconductor device. The adhesive is provided on the sides of the semiconductor device and the surface of the mounting board such that it covers the area of thermally expandable particles. This improves the impact resistance of the semiconductor device soldered onto the mounting board, and also facilitates removal of the semiconductor device from the mounting board when the semiconductor device needs repair.
公开/授权文献
- US07993984B2 Electronic device and manufacturing method 公开/授权日：2011-08-09
信息查询
IPC分类:
