A panel for use in constructing a mat or a road and method for same is provided. The panel can include a wafer having at least three sides operatively coupled to an edge having a complementary profile for overlapping and attaching to another edge coupled to another wafer. The edge can be attached to the wafer using a scarf joint or a mortise and tenon joint. The complementary profile can include a lap joint, a tapered lap joint, an S-shaped lap joint or a modified lap joint for use with fasteners for attaching two edges together.