An optoelectronic device may be fabricated on a three dimensional surface by transferring a material from an elastomeric stamp to a non-planar substrate. The use of an elastomeric stamp allows for patterned layers to be deposited on a non-planar substrate with reduced chance of damage to the patterned layer. The material may be deposited on the stamp while the stamp is in a planar configuration or after the stamp has been deformed to a shape generally the same as the shape of the non-planar substrate. The material may be transferred by cold welding. The device may include organic layers.