发明申请
- 专利标题： Retaining Ring with Shaped Profile
- 专利标题（中）： 带形状的保持环
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申请号： US11780335申请日： 2007-07-19
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公开(公告)号： US20090021024A1公开(公告)日： 2009-01-22
- 发明人: Gopalakrishna B. Prabhu , Yin Yuan , Jeonghoon Oh , Gregory E. Menk
- 申请人： Gopalakrishna B. Prabhu , Yin Yuan , Jeonghoon Oh , Gregory E. Menk
- 主分类号： B65D45/32
- IPC分类号： B65D45/32
摘要：
Retaining rings with curved surfaces are described. The curved surfaces prevent damage to a fixed abrasive polishing pad when the retaining ring is used in a polishing process. The curved surfaces are on the bottom surface of the ring, such as along the outer diameter and/or along the sidewalls of channels formed in the bottom of the ring.
公开/授权文献
- US08033895B2 Retaining ring with shaped profile 公开/授权日：2011-10-11
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