发明申请
- 专利标题： DESIGN STRUCTURES, METHOD AND SYSTEMS OF POWERING ON INTEGRATED CIRCUIT
- 专利标题（中）： 集成电路供电的设计结构，方法和系统
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申请号： US11866537申请日： 2007-10-03
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公开(公告)号： US20090021085A1公开(公告)日： 2009-01-22
- 发明人: Igor Arsovski , Anthony R. Bonaccio , Serafino Bueti , Hayden C. Cranford, JR. , Joseph A. Iadanza , Todd E. Leonard , Hemen R. Shah , Pradeep Thiagarajan , Sebastian T. Ventrone
- 申请人： Igor Arsovski , Anthony R. Bonaccio , Serafino Bueti , Hayden C. Cranford, JR. , Joseph A. Iadanza , Todd E. Leonard , Hemen R. Shah , Pradeep Thiagarajan , Sebastian T. Ventrone
- 申请人地址： US NY Armonk
- 专利权人： INTERNATIONAL BUSINESS MACHINES CORPORATION
- 当前专利权人： INTERNATIONAL BUSINESS MACHINES CORPORATION
- 当前专利权人地址： US NY Armonk
- 主分类号： H01H37/32
- IPC分类号： H01H37/32
摘要：
Design structures, method and systems of powering on an integrated circuit (IC) are disclosed. In one embodiment, the system includes a region in the IC including functional logic, a temperature sensor for sensing a temperature in the region when the IC is powered up and a heating element therefor; a processing unit including: a comparator for comparing the temperature against a predetermined temperature value, a controller, which in the case that the temperature is below the predetermined temperature value, delays functional operation of the IC and controls heating of the region of the IC, and a monitor for monitoring the temperature in the region; and wherein the controller, in the case that the temperature rises above the predetermined temperature value, ceases the heating and initiates functional operation of the IC.
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