发明申请
US20090022893A1 PUNCHED ADHESIVE TAPE FOR SEMICCONDUCTOR, METHOD OF MANUFACTURING LEAD FRAME WITH THE ADHESIVE TAPE, LEAD FRAME WITH THE ADHESIVE TAPE, AND SEMICONDUCTOR DEVICE COMPRISING THE LEAD FRAME
审中-公开
用于半导体的压电胶带，用粘合带制造引线框架的方法，带有粘合带的引线框架以及包含引线框架的半导体器件
- 专利标题： PUNCHED ADHESIVE TAPE FOR SEMICCONDUCTOR, METHOD OF MANUFACTURING LEAD FRAME WITH THE ADHESIVE TAPE, LEAD FRAME WITH THE ADHESIVE TAPE, AND SEMICONDUCTOR DEVICE COMPRISING THE LEAD FRAME
- 专利标题（中）： 用于半导体的压电胶带，用粘合带制造引线框架的方法，带有粘合带的引线框架以及包含引线框架的半导体器件
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申请号： US12236756申请日： 2008-09-24
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公开(公告)号： US20090022893A1公开(公告)日： 2009-01-22
- 发明人: Yoshiyuki Tanabe , Yoshihiro Nomura , Hiroshi Kirihara , Youichi Hosokawa , Shinji Iioka , Satoru Yanagisawa
- 申请人： Yoshiyuki Tanabe , Yoshihiro Nomura , Hiroshi Kirihara , Youichi Hosokawa , Shinji Iioka , Satoru Yanagisawa
- 优先权： JP9-193637 19970718
- 主分类号： B05D3/12
- IPC分类号： B05D3/12
摘要：
A punched adhesive tape for semiconductor which is made by punching an adhesive tape comprising a base film and an adhesive layer provided on one or each side of the base film to mark the regions in the adhesive tape where contaminants or defects are contained; a method of producing an adhesive tape-bearing lead frame by punching the punched adhesive tape for semiconductor, with the parts containing the punched holes skipped over, and applying the adhesive tape pieces punched out from the punched adhesive tape for semiconductor to a lead frame; a semiconductor device fabricated by using the adhesive-bearing lead frame.
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