Invention Application
- Patent Title: Bending Apparatus
- Patent Title (中): 弯曲装置
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Application No.: US10599706Application Date: 2005-03-28
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Publication No.: US20090024246A1Publication Date: 2009-01-22
- Inventor: Hidekatsu Ikeda , Takanori Okubo , Kazuhiro Kanno , Hisashi Uto
- Applicant: Hidekatsu Ikeda , Takanori Okubo , Kazuhiro Kanno , Hisashi Uto
- Applicant Address: JP Kanagawa
- Assignee: AMADA CO., LTD.
- Current Assignee: AMADA CO., LTD.
- Current Assignee Address: JP Kanagawa
- Priority: JP2004-111747 20040406; JP2005-52287 20050228
- International Application: PCT/JP2005/006533 WO 20050328
- Main IPC: G06F19/00
- IPC: G06F19/00

Abstract:
A bending apparatus is provided with a ram start-up device so as to be movable in a lateral direction. A controller moves the ram start-up device to a point in front of positioning points of abutments corresponding to points of selected edges of a workpiece. The bending apparatus includes a foreign object detector that detects the entry of a foreign object into a region of movement of the ram start-up device. A controller prevents the ram start-up device from moving when the entry of the foreign object is detected.
Public/Granted literature
- US07818985B2 Bending apparatus Public/Granted day:2010-10-26
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