发明申请
US20090026475A1 Semiconductor Light Emitting Device and Method for Manufacturing the Same 有权
半导体发光器件及其制造方法

  • 专利标题: Semiconductor Light Emitting Device and Method for Manufacturing the Same
  • 专利标题(中): 半导体发光器件及其制造方法
  • 申请号: US12087173
    申请日: 2006-12-28
  • 公开(公告)号: US20090026475A1
    公开(公告)日: 2009-01-29
  • 发明人: Atsushi YamaguchiKen Nakahara
  • 申请人: Atsushi YamaguchiKen Nakahara
  • 申请人地址: JP Kyoto-shi
  • 专利权人: ROHM CO., LTD.
  • 当前专利权人: ROHM CO., LTD.
  • 当前专利权人地址: JP Kyoto-shi
  • 优先权: JP2005-380682 20051229
  • 国际申请: PCT/JP2006/326216 WO 20061228
  • 主分类号: H01L33/00
  • IPC分类号: H01L33/00
Semiconductor Light Emitting Device and Method for Manufacturing the Same
摘要:
Concaves and convexes are formed in a light transmitting conductive layer provided on a surface of a light emitting device made of nitride semiconductor, thereby light emitted from a light emitting layer is totally reflected repeatedly in a semiconductor lamination portion and a substrate and can be effectively taken out without attenuation, and external quantum efficiency can be improved. A semiconductor lamination portion (6) is formed by laminating nitride semiconductor layers including an n-type layer (3) and a p-type layer (5) on one side of a substrate (1) so as to form a light emitting layer, and a light transmitting conductive layer (7) is provided at a surface side of the semiconductor lamination portion. A concave-convex pattern, i.e., concaves (7a), is provided on a surface of the light transmitting conductive layer. A p-side electrode (8) is provided on the light transmitting conductive layer, and an n-side electrode (9) is electrically connected to the n-type layer exposed by etching a part of the semiconductor lamination portion.
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