发明申请
US20090026605A1 Heat Extraction from Packaged Semiconductor Chips, Scalable with Chip Area
有权
封装半导体芯片的热提取,可扩展芯片面积
- 专利标题: Heat Extraction from Packaged Semiconductor Chips, Scalable with Chip Area
- 专利标题(中): 封装半导体芯片的热提取,可扩展芯片面积
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申请号: US11828853申请日: 2007-07-26
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公开(公告)号: US20090026605A1公开(公告)日: 2009-01-29
- 发明人: Vikas Gupta , Siva P. Gurrum , Gregory Eric Howard
- 申请人: Vikas Gupta , Siva P. Gurrum , Gregory Eric Howard
- 申请人地址: US TX Dallas
- 专利权人: Texas Instruments Incorporated
- 当前专利权人: Texas Instruments Incorporated
- 当前专利权人地址: US TX Dallas
- 主分类号: H01L23/34
- IPC分类号: H01L23/34 ; H01L21/00
摘要:
A semiconductor device (100A) with plastic encapsulation compound (102) and metal sheets (103a and 104) on both surfaces, acting as heat spreaders. One or more thermal conductors (103a) of preferably uniform height connect one sheet (103b) and the chip surface (101a); the number of conductors is scalable with the chip size. Each conductor consists of an elongated wire loop (preferably copper) with the wire ends attached to a pad (105), preferably both ends to the same pad. The major loop diameter is approximately normal to the first surface and the loop vertex in contact with the sheet (103b). The substrate (104, preferably a second metal sheet) covers at least portions of the second package surface and is thermally conductively connected to the chip.