A method of removing contamination from a substrate having an ion-implanted region is described. The method comprises applying a composition comprising a fluorinated solvent and a co-solvent to the substrate in an amount sufficient to assist in the removal of contamination from the substrate. As contaminant is removed, metal patterns or other desired features on the substrate remain. Additionally, the composition for removing contamination is not harmful to the user or the substrate (i.e., non-flammable and/or non caustic).