发明申请
- 专利标题： METHOD FOR WASHING DEVICE SUBSTRATE
- 专利标题（中）： 洗涤装置基板的方法
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申请号： US12233669申请日： 2008-09-19
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公开(公告)号： US20090029894A1公开(公告)日： 2009-01-29
- 发明人: Hidekazu Okamoto , Hideo Namatsu
- 申请人： Hidekazu Okamoto , Hideo Namatsu
- 申请人地址： JP Chiyoda-ku JP Tokyo
- 专利权人： ASAHI GLASS COMPANY, LIMITED,NTT Advanced Technology Corporation
- 当前专利权人： ASAHI GLASS COMPANY, LIMITED,NTT Advanced Technology Corporation
- 当前专利权人地址： JP Chiyoda-ku JP Tokyo
- 优先权： JP2006-104187 20060405
- 主分类号： G03F7/42
- IPC分类号： G03F7/42
摘要：
The present invention provides a washing method for a device substrate, capable of sufficiently removing a resist attached to a device substrate, particularly a resist attached to fine pore portions of a pattern having a large aspect ratio.A method for washing a device substrate, which comprises a washing step of removing a resist attached to a device substrate by means of a solvent, wherein the solvent is a composition comprising at least one fluorinated compound selected from the group consisting of a hydrofluoroether, a hydrofluorocarbon and a perfluorocarbon, and a fluorinated alcohol.
公开/授权文献
- US08143203B2 Method for washing device substrate 公开/授权日：2012-03-27
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