A clip module and a heat dissipation device having the same are disclosed, wherein the heat dissipation device is suitable to dissipate the heat for a heat source on a circuit board. The heat dissipation device includes a retention module, a heat sink and a clip module. The retention module is provided on the circuit board and around the heat source, and the heat sink is provided on the heat source. The clip module includes a body, a fastener fastened to the retention module and a pressing structure. The pressing structure includes a first triangle block and a second triangle block which is slidably provided on two adjacent surfaces of the first triangle block, and the fastener is pivotally provided at the second triangle block.