发明申请
- 专利标题： SEMICONDUCTOR DEVICE
- 专利标题（中）： 半导体器件
-
申请号： US11910912申请日： 2006-03-28
-
公开(公告)号： US20090032977A1公开(公告)日： 2009-02-05
- 发明人: Tsunemori Yamaguchi
- 申请人： Tsunemori Yamaguchi
- 优先权： JP2005-112392 20050804
- 国际申请： PCT/JP2006/306326 WO 20060328
- 主分类号： H01L23/28
- IPC分类号： H01L23/28
摘要：
The present invention is disclosed a semiconductor device which enables to easily perform a visual inspection of the bonded state between a lead and a land of wiring board. This semiconductor device comprises a lead in which at least a part of the lower surface thereof is exposed form the lower surface of the encapsulation resin and the end face thereof is exposed from the lateral surface of the encapsulation resin. The lower surface of the lead is provided with a groove which reaches the outer end edge of the lead.
信息查询
IPC分类:
