A method of preventing adhesive bleed onto the metal (e.g., gold) surfaces of a plurality of electrical conductors (e.g., wire-bond pads) positioned on a dielectric substrate when positioning an electronic component onto the dielectric substrate and electrically coupling (e.g., wire-bonding) the component to the metal surfaces. The method includes contacting the metal surfaces with a chemical composition which comprises a minor amount of a surface active agent (e.g., a thiol) and the remainder substantially being a non-reactive solvent (e.g., methanol). A circuitized substrate produced using this method is also provided.