发明申请
- 专利标题： Electronic device housing assembly
- 专利标题（中）： 电子设备外壳组件
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申请号： US11888407申请日： 2007-07-31
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公开(公告)号： US20090035549A1公开(公告)日： 2009-02-05
- 发明人: Jeffrey A. Lev , Steven S. Homer
- 申请人： Jeffrey A. Lev , Steven S. Homer
- 主分类号： B32B27/04
- IPC分类号： B32B27/04 ; B29C45/14
摘要：
An electronic device comprising a housing assembly having at least one fiber composite layer molded into a portion of the housing assembly, the at least one fiber composite layer having a warp direction and configured to provide strength to the housing assembly corresponding to the warp direction.
公开/授权文献
- US08574696B2 Electronic device housing assembly 公开/授权日：2013-11-05