发明申请
US20090039142A1 Method for Forming a Solder Mold with Venting Channels and Method for Using the Same
审中-公开
用于形成具有排气通道的焊模的方法及其使用方法
- 专利标题： Method for Forming a Solder Mold with Venting Channels and Method for Using the Same
- 专利标题（中）： 用于形成具有排气通道的焊模的方法及其使用方法
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申请号： US11834425申请日： 2007-08-06
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公开(公告)号： US20090039142A1公开(公告)日： 2009-02-12
- 发明人: Raschid Jose Bezama , Russell Alan Budd , Evan George Colgan , Peter Alfred Gruber , Valerie Oberson
- 申请人： Raschid Jose Bezama , Russell Alan Budd , Evan George Colgan , Peter Alfred Gruber , Valerie Oberson
- 主分类号： B23K1/20
- IPC分类号： B23K1/20 ; B22D18/00 ; C03C15/00
摘要：
A method for forming a solder mold for transferring solder to a wafer includes etching a plurality of solder cavities into a substrate. A plurality of ventilation channels are etched on the substrate connecting the plurality of solder cavities.
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