发明申请
- 专利标题: Shallow Trench Isolation with Improved Structure and Method of Forming
- 专利标题(中): 浅沟槽隔离与改进的结构和形成方法
-
申请号: US11838666申请日: 2007-08-14
-
公开(公告)号: US20090045482A1公开(公告)日: 2009-02-19
- 发明人: Jhon-Jhy Liaw , Chao-Cheng Chen , Chia-Wei Chang
- 申请人: Jhon-Jhy Liaw , Chao-Cheng Chen , Chia-Wei Chang
- 主分类号: H01L29/00
- IPC分类号: H01L29/00
摘要:
A shallow trench isolation (STI) structure has a top portion tapering in width from wide to narrow in a direction from a substrate surface, from a first width at a top of the first portion to a second width at a bottom of the first portion. The STI structure also includes a bottom portion below the top portion, which expands from the bottom of the top portion to a substantially widened lateral distance having a third width. The third width is, in general, substantially larger than the second width. The inventive STI structure can provide desired isolation characteristics with a significantly reduced aspect ratio, thus suitable for device isolations in advanced processing technology.
公开/授权文献
信息查询
IPC分类: