发明申请
- 专利标题: SUBSTRATE PROCESSING APPARATUS AND METHOD
- 专利标题(中): 基板加工装置和方法
-
申请号: US12146730申请日: 2008-06-26
-
公开(公告)号: US20090047433A1公开(公告)日: 2009-02-19
- 发明人: Chun-Sik KIM , Gyeong-Hoon Kim
- 申请人: Chun-Sik KIM , Gyeong-Hoon Kim
- 优先权: KR10-2007-0081382 20070813; KR10-2007-0096099 20070920
- 主分类号: B05D3/00
- IPC分类号: B05D3/00 ; C23C14/00
摘要:
A substrate processing apparatus includes a first chamber, a second chamber provided adjacent the first chamber to form a process space therebetween, a support unit supporting the second chamber with a gap between the first and second chambers, and a vacuum unit to place the process space in a vacuum state, the process spaced sealed in the vacuum state.