发明申请
- 专利标题： Heat-sensitive adhesive material, adhered article, process and apparatus for thermally activating the heat-sensitive adhesive material
- 专利标题（中）： 热敏粘合剂材料，附着物，用于热活化热敏粘合剂材料的方法和装置
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申请号： US12288176申请日： 2008-10-16
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公开(公告)号： US20090050268A1公开(公告)日： 2009-02-26
- 发明人: Mitsunobu Morita , Tomoyuki Kugo , Hiroshi Goto , Norihiko Inaba
- 申请人： Mitsunobu Morita , Tomoyuki Kugo , Hiroshi Goto , Norihiko Inaba
- 优先权： JP2003-146117 20030523; JP2004-137348 20040506
- 主分类号： B32B37/06
- IPC分类号： B32B37/06
摘要：
A heat-sensitive adhesive material contains a substrate and a heat-sensitive adhesive layer that contains a thermoplastic resin and a solid plasticizer, and the heat-sensitive adhesive material is so configured as to be heated and applied to an adherend, wherein the heat-sensitive adhesive material exhibits such an adhesive strength to the adherend as to increase with time from immediately after applying the heat-sensitive adhesive material to the adherend.
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