Invention Application
- Patent Title: HEAT PIPE STRUCTURE OF A HEAT RADIATOR
- Patent Title (中): 散热器的热管结构
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Application No.: US11844946Application Date: 2007-08-24
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Publication No.: US20090050305A1Publication Date: 2009-02-26
- Inventor: Sin-Wei He , Tzu-Hsin Huang , Yu-Chin Lin
- Applicant: Sin-Wei He , Tzu-Hsin Huang , Yu-Chin Lin
- Applicant Address: TW Chu Pei City
- Assignee: FORCECON TECHNOLOGY Co., Ltd.
- Current Assignee: FORCECON TECHNOLOGY Co., Ltd.
- Current Assignee Address: TW Chu Pei City
- Main IPC: F28F1/30
- IPC: F28F1/30

Abstract:
The present invention provides a heat pipe structure of a heat radiator, which includes two vertically protruded radiating portions and heat-absorbing portions at a bottom of the two radiating portions. The heat-absorbing portions are assembled onto the heat-conducting pedestal. Two turning portions are formed at the intersection of the heat-absorbing portions and two radiating portions. The heat-absorbing portion has a curved shape. The heat-absorbing portions of adjacent heat pipes are misaligned, such that the turning portion of the heat-absorbing portion of one heat pipe aligns with the recessed space of the other heat pipe. A minimum of heat pipe assembly space obtains a maximum heating area, thus greatly improving the heat-radiating effect and reducing the manufacturing cost with better applicability and economic efficiency.
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