发明申请
- 专利标题： Lead Frame with Non-Conductive Connective Bar
- 专利标题（中）： 带非导电连杆的引线框架
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申请号： US12204493申请日： 2008-09-04
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公开(公告)号： US20090051017A1公开(公告)日： 2009-02-26
- 发明人: Beng Tatt Wee , Fuaida Harun , Soon Hock Tong , Robert-Christian Hagen , Yang Hong Heng , Kean Cheong Lee
- 申请人： Beng Tatt Wee , Fuaida Harun , Soon Hock Tong , Robert-Christian Hagen , Yang Hong Heng , Kean Cheong Lee
- 申请人地址： DE Neubiberg
- 专利权人： INFINEON TECHNOLOGIES AG
- 当前专利权人： INFINEON TECHNOLOGIES AG
- 当前专利权人地址： DE Neubiberg
- 主分类号： H01L23/495
- IPC分类号： H01L23/495 ; H01L21/50
摘要：
An electronic component includes a lead frame, a semiconductor chip and an encapsulating body. The lead frame includes a heat spreader area, a plurality of conductive lead fingers, at least one non-conductive tie bar, and a metal joint. The metal joint connects the at least one non-conductive tie bar to the heat spreader area. The semiconductor chip is provided on a die pad located on the heat spreader area. The encapsulating body covers at least part of the semiconductor chip, at least part of the at least one non-conductive tie bar and part of the lead frame.
公开/授权文献
- US07795712B2 Lead frame with non-conductive connective bar 公开/授权日：2010-09-14
信息查询
IPC分类:
