发明申请
- 专利标题： Package structure and manufacturing method thereof
- 专利标题（中）： 包装结构及其制造方法
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申请号： US12222610申请日： 2008-08-13
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公开(公告)号： US20090051048A1公开(公告)日： 2009-02-26
- 发明人: Yi-Shao Lai , Tsung-Yueh Tsai , Hsiao-Chuan Chang
- 申请人： Yi-Shao Lai , Tsung-Yueh Tsai , Hsiao-Chuan Chang
- 申请人地址： TW Kaohsiung
- 专利权人： Advanced Semiconductor Engineering, Inc.
- 当前专利权人： Advanced Semiconductor Engineering, Inc.
- 当前专利权人地址： TW Kaohsiung
- 优先权： TW96130959 20070821
- 主分类号： H01L21/60
- IPC分类号： H01L21/60 ; H01L23/48
摘要：
A package structure and a manufacturing method thereof are provided. The package structure includes a carrier, a chip-bonding structure and a chip. The chip-bonding structure is formed on a first surface of the carrier. The chip-bonding structure includes a cavity, a dam, several via holes and several solder bumps. The solder bumps are received in the via holes and are correspond to the first connecting pads located on the carrier. The chip is embedded in the cavity of the chip-bonding structure. An active surface of the chip is tightly pasted on the first surface of the chip-bonding structure, and the first solder pads form electrical contact with the corresponding solder bumps. The chip of the package structure is precisely disposed on the carrier, not only simplifying the manufacturing process but also forming stable electrical connection between the chip and the carrier of the package structure.
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