Invention Application
- Patent Title: Printed circuit board, method of manufacturing the printed circuit board, memory module having the printed circuit board and method of manufacturing the memory module
- Patent Title (中): 印刷电路板,制造印刷电路板的方法,具有印刷电路板的存储模块和制造存储器模块的方法
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Application No.: US12231196Application Date: 2008-08-29
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Publication No.: US20090056979A1Publication Date: 2009-03-05
- Inventor: Seong-Chan Han , Dong-Chun Lee , Young-Soo Lee
- Applicant: Seong-Chan Han , Dong-Chun Lee , Young-Soo Lee
- Applicant Address: KR Suwon-si
- Assignee: Samsung Electronics Co., Ltd
- Current Assignee: Samsung Electronics Co., Ltd
- Current Assignee Address: KR Suwon-si
- Priority: KR10-2007-0088906 20070903
- Main IPC: H05K1/00
- IPC: H05K1/00 ; H05K3/00

Abstract:
A PCB can include an insulating member, a cooling member, and a circuit pattern. The cooling member can be built into the insulating member. The cooling member can have a cooling passageway through which a cooling fluid can flow. The circuit pattern can be formed on the insulating member. Thus, high heat in the circuit pattern can be rapidly dissipated by the cooling fluid flowing through the cooling passageway.
Public/Granted literature
Information query