发明申请
- 专利标题: PACKAGE STRUCTURE FOR MICRO-SENSOR
- 专利标题(中): 微型传感器的包装结构
-
申请号: US12186388申请日: 2008-08-05
-
公开(公告)号: US20090057789A1公开(公告)日: 2009-03-05
- 发明人: Long Sun Huang , Yung Shan Chiou , Kuan Yi Lin , Yi Kuang Yen , Chia Ming Hung
- 申请人: Long Sun Huang , Yung Shan Chiou , Kuan Yi Lin , Yi Kuang Yen , Chia Ming Hung
- 申请人地址: TW Taipei City
- 专利权人: Long-Sun Huang
- 当前专利权人: Long-Sun Huang
- 当前专利权人地址: TW Taipei City
- 优先权: TW096133076 20070905
- 主分类号: H01L29/00
- IPC分类号: H01L29/00
摘要:
The invention discloses a package structure for a micro-sensor including a micro-cantilever for capturing a chemical substance. The package structure, according to the invention, includes a first substrate, a second substrate, and a casing. The first substrate thereon forms a processing circuit. The micro-sensor is bonded to a first upper surface of the first substrate and is electrically connected to the processing circuit capable of outputting a signal relative to the chemical substance sensed by the micro-sensor. The second substrate has a formed-through aperture. The second substrate is bonded to the first substrate such that the micro-sensor is disposed in the formed-through aperture. The casing is bonded to the second substrate and includes a reaction chamber in which the micro-cantilever is installed and a fluid containing the chemical substance flows into.
信息查询
IPC分类: