发明申请
- 专利标题： Semiconductor memory package
- 专利标题（中）： 半导体存储器封装
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申请号： US12230243申请日： 2008-08-26
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公开(公告)号： US20090057860A1公开(公告)日： 2009-03-05
- 发明人: Seok Bae , Yul-Kyo Chung , Sung-Taek Lim , Hyung-Mi Jung , Yee-Na Shin , Seung-Hyun Sohn , Jin-Seok Moon
- 申请人： Seok Bae , Yul-Kyo Chung , Sung-Taek Lim , Hyung-Mi Jung , Yee-Na Shin , Seung-Hyun Sohn , Jin-Seok Moon
- 申请人地址： KR Suwon
- 专利权人： SAMSUNG ELECTRO-MECHANICS CO., LTD.
- 当前专利权人： SAMSUNG ELECTRO-MECHANICS CO., LTD.
- 当前专利权人地址： KR Suwon
- 优先权： KR10-2007-0086244 20070827
- 主分类号： H01L23/48
- IPC分类号： H01L23/48
摘要：
Disclosed is a semiconductor memory package having a thin-film decoupling capacitor that reduces radio frequency noise. The semiconductor memory package in accordance with an embodiment of the present invention includes a substrate, a memory chip being mounted on one side of the substrate and a decoupling capacitor formed in the vicinity one the side of the substrate where the memory chip is mounted.