发明申请
- 专利标题： Semiconductor Device Having Wafer Level Chip Scale Packaging Substrate Decoupling
- 专利标题（中）： 具有晶片级芯片级封装衬底去耦的半导体器件
-
申请号： US12048294申请日： 2008-03-14
-
公开(公告)号： US20090057889A1公开(公告)日： 2009-03-05
- 发明人: Rajen M. Murugan , Robert F. McCarthy , Baher S. Haroun , Peter R. Harper
- 申请人： Rajen M. Murugan , Robert F. McCarthy , Baher S. Haroun , Peter R. Harper
- 申请人地址： US TX Dallas
- 专利权人： Texas Instruments Inc.
- 当前专利权人： Texas Instruments Inc.
- 当前专利权人地址： US TX Dallas
- 主分类号： H01L23/48
- IPC分类号： H01L23/48 ; H01L21/20 ; H01L21/44
摘要：
One aspect of the invention provides a semiconductor device that includes a microchip having an outermost surface. First and second bond pads are located on the microchip and near the outermost surface. A first UBM contact is located on the outermost surface and between the first and second bond pads. The first UBM contact is offset from the first bond pad. A second UBM contact is located on the outermost surface and between the first and second bond pads. The second UBM contact is offset from the second bond pad, and a capacitor supported by the microchip is located between the first and second UBM contacts.
公开/授权文献
信息查询
IPC分类:
